The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2020
Filed:
Feb. 25, 2015
Dowa Metaltech Co., Ltd., Tokyo, JP;
Yazaki Corporation, Tokyo, JP;
Tatsunori Murata, Tokyo, JP;
Hirotaka Kotani, Tokyo, JP;
Hideki Endo, Tokyo, JP;
Akira Sugawara, Tokyo, JP;
Yuta Sonoda, Tokyo, JP;
Tetsuo Kato, Shizuoka, JP;
Hideki Ohsumi, Shizuoka, JP;
Jyun Toyoizumi, Shizuoka, JP;
DOWA METALTECH CO., LTD., Tokyo, JP;
YAZAKI CORPORATION, Tokyo, JP;
Abstract
In a tin-plated product wherein a surface of a substrateof copper or a copper alloy is plated with tin, an underlying layerof at least one of nickel and a copper-nickel alloy is formed on the surface of the substrate, and an outermost layer formed on the surface of the underlying layeris composed of a copper-tin alloy layerand tin layers, the copper-tin alloybeing formed of a large number of crystal grains of a copper-tin alloy, each of the tin layersbeing arranged in a corresponding one of recessed portions, each of which is formed between adjacent crystal grains of the large number of crystal grains of the copper-tin alloy, the adjacent crystal grains being adjacent to each other on the outermost surface of the outer most layer, the area ratio occupied by the tin layerson the outermost surface being 20 to 80%, and the maximum thickness of the tin layersbeing smaller than the average particle diameter of the crystal grains of the copper-tin alloy.