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Dowa Mining Co., Ltd.

USPTO Granted Patents = 217

% Expired Patents = 10.6

CIPO Patents = 1

Trademarks = 2

Forward Citations = 1,855

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322 inventors (with patents filed for the assignee):

Hideyo Osanai (18 out of 35 patents)

Masami Kimura (16 out of 24 patents)

Akira Sugawara (13 out of 86 patents)

4. Kazushi Sano (12 out of 12 patents)

5. Masami Sakuraba (12 out of 12 patents)

6. Seiichi Hisano (11 out of 11 patents)

7. Makoto Namioka (10 out of 11 patents)

8. Kishio Tayama (9 out of 9 patents)

9. Junji Nakamura (8 out of 23 patents)

10. Nobuyoshi Tsukaguchi (8 out of 8 patents)

11. Shuji Yoshizawa (8 out of 26 patents)

12. Akira Nagatomi (7 out of 38 patents)

13. Takayuki Takahashi (7 out of 25 patents)

14. Kazuhisa Saito (7 out of 10 patents)

15. Kazuyuki Matsumoto (6 out of 45 patents)

Core Competencies:

Metal-Ceramic Bonding

Silver Powder

Semiconductor Substrates

Indium Oxide Powder

Phosphor Mixture

Magnetic Powder

Composite Plated Product

Aluminum-Ceramic Bonding

Hydrogen Storage Alloy

Sintered Rare Earth Magnetic Alloy

Copper-Based Alloy

Heat Treatment Method

217 patents: Sort by Forward Citations

1. 8992701 - Silver powder and method for producing same (2015-03-31),

2. 8282702 - Silver powder and method for producing same (2012-10-09),

3. 7820138 - Indium oxide powder and method for producing same (2010-10-26),

4. 7722728 - Heat treatment method and heat treatment apparatus (2010-05-25),

5. 7651785 - Tin-plated product (2010-01-26),

6. 7641817 - Silver powder and method for producing same (2010-01-05),

7. 7585588 - Battery positive electrode material (2009-09-08),

8. 7575643 - Carburization treatment method (2009-08-18),

9. 7514022 - Composite plated product and method for producing same (2009-04-07),

10. 7481698 - Sintered rare earth magnetic alloy wafer surface grinding machine (2009-01-27),

11. 7462301 - Silver powder (2008-12-09),

12. 7445672 - Method of forming group-III nitride crystal, layered structure and epitaxial substrate (2008-11-04),

13. 7394024 - Oxide superconductor current lead and method of manufacturing the same, and superconducting system (2008-07-01),

14. 7393596 - Aluminum/ceramic bonding substrate and method for producing same (2008-07-01),

15. 7393473 - Method for producing a composite plated product (2008-07-01),

Company Overview

Dowa Mining Co., Ltd., headquartered in Tokyo, specializes in advanced materials and technologies, particularly in the field of metal-ceramic bonding. The company is recognized for its innovative solutions in semiconductor substrates, silver powder, and various composite materials, including aluminum-ceramic bonding and magnetic powders. Dowa's expertise extends to the development of phosphor mixtures and indium oxide powders, catering to diverse industries and contributing to advancements in electronics and materials science.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

217 Patents

#336 in Tokyo

#671 in Japan

#3,936 in the World

Dowa Mining Co., Ltd.

Forward Citations = 1,855

322 inventors:

Hideyo Osanai (18 out of 35 patents)

Masami Kimura (16 out of 24 patents)

Akira Sugawara (13 out of 86 patents)

4. Kazushi Sano (12 out of 12 patents)

5. Masami Sakuraba (12 out of 12 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Dowa Mining Co., Ltd.. Retrieved from https://idiyas.com/company/dowa-mining-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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