The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2024

Filed:

Sep. 08, 2021
Applicant:

Dowa Metaltech Co., Ltd., Tokyo, JP;

Inventors:

Hideyo Osanai, Tokyo, JP;

Akira Sugawara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22D 19/04 (2006.01); B23K 1/19 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01); B23K 1/00 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
B32B 9/041 (2013.01); B22D 19/04 (2013.01); B23K 1/19 (2013.01); B32B 9/007 (2013.01); H05K 1/0201 (2013.01); H05K 7/2039 (2013.01); B23K 1/0016 (2013.01); B23K 2101/36 (2018.08); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2307/302 (2013.01); B32B 2307/724 (2013.01); B32B 2457/08 (2013.01);
Abstract

To provide a heat radiation member having high durability that can favorably retain the thermal conductivity under application of heat cycles, suitable for mounting a semiconductor element of a power module. The heat radiation member includes a laminated structure including metal materialsandand a carbon materialhaving the following property (A) bonded to each other; (A) in pressurizing one principal surface of a plate specimen having a thickness of 11 mm of the carbon material with nitrogen gas of 200 kPa, the carbon material having a gas permeability of the nitrogen gas permeating to the other principal surface with a flow rate of 5 L/min or more and 30 L/min or less per 0.01 min terms of area of the pressurized principal surface, the pressurized principal surface having an area of 0.005 mor more.


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