The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Apr. 20, 2016
Applicants:

Dowa Metaltech Co., Ltd., Tokyo, JP;

Yazaki Corporation, Tokyo, JP;

Inventors:

Hirotaka Kotani, Tokyo, JP;

Hiroto Narieda, Tokyo, JP;

Hideki Endo, Tokyo, JP;

Akira Sugawara, Tokyo, JP;

Yuta Sonoda, Tokyo, JP;

Takaya Kondo, Shizuoka, JP;

Jyun Toyoizumi, Shizuoka, JP;

Yuya Kishibata, Shizuoka, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/00 (2006.01); C25D 3/60 (2006.01); C25D 5/10 (2006.01); C25D 5/12 (2006.01); H01R 13/03 (2006.01); C25D 7/00 (2006.01); C25D 3/58 (2006.01); C25D 3/38 (2006.01); C25D 3/12 (2006.01); C25D 3/30 (2006.01);
U.S. Cl.
CPC ...
C25D 3/60 (2013.01); C25D 5/10 (2013.01); C25D 5/12 (2013.01); H01R 13/03 (2013.01); C25D 3/12 (2013.01); C25D 3/30 (2013.01); C25D 3/38 (2013.01); C25D 3/58 (2013.01); C25D 7/00 (2013.01); H01R 2201/26 (2013.01); Y10T 428/12694 (2015.01);
Abstract

There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layeris formed on a substrateof copper or a copper alloy so as to have a thickness of 0.1 to 1.5 μm by electroplating, a tin-copper plating layercontaining tinmixed with a copper-tin alloyis formed thereon so as to have a thickness of 0.6 to 10 μm by electroplating using a tin-copper plating bath which contains 5 to 35% by weight of copper with respect to the total amount of tin and copper, and then, a tin layeris formed thereon so as to have a thickness of 1 μm or less by electroplating if necessary.


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