Gerben Doornbos

Leuven, Belgium

Gerben Doornbos

Average Co-Inventor Count = 2.8

ph-index = 9

Forward Citations = 325(Granted Patents)

Forward Citations (Not Self Cited) = 260(Sep 21, 2024)

DiyaCoin DiyaCoin 0.82 

Inventors with similar research interests:


Location History:

  • Kessel-L9, BE (2010)
  • Heverlee, BE (2010)
  • Redhill, GB (2015)
  • Hsinchu, CN (2022)
  • Leuven, BE (2012 - 2023)
  • Hsin-Chu, TW (2017 - 2023)
  • Kessel-Lo, BE (2011 - 2024)


Years Active: 2010-2025

where 'Filed Patents' based on already Granted Patents

140 patents (USPTO):

Title: Gerben Doornbos: A Prodigy in Semiconductor Technologies

Introduction:

Gerben Doornbos, hailing from Leuven, Belgium, is an accomplished inventor and researcher in the field of semiconductor devices and technologies. With an impressive portfolio of 100 patents, his contributions have significantly advanced the field, particularly in the areas of semiconductor device design and complementary MOSFET technology. This article delves into some of his latest patents, notable affiliations, and collaborations with esteemed colleagues.

Latest Patents:

Gerben Doornbos' recent patents demonstrate his expertise in semiconductor device innovation. Notably, his patent titled "Semiconductor Device and Method for Forming the Same" has garnered attention. This invention describes a semiconductor device that incorporates a substrate, a semiconductor fin, source/drain structures, through-substrate vias (TSVs), and buried power lines. This patent showcases Doornbos' ability to optimize performance while enhancing the integration of complex components within a semiconductor device.

Another compelling patent is entitled "Complementary MOSFETs Vertically Arranged and Including Multiple Dielectric Layers Surrounding the MOSFETs." This invention introduces a novel approach to the fabrication of complementary MOSFETs by forming a fin structure with multiple sacrificial and semiconductor layers, resulting in improved performance and reduced power consumption. These patents reflect Doornbos' commitment to pushing boundaries and driving innovation in the semiconductor industry.

Professional Background and Affiliations:

Gerben Doornbos' exceptional contributions have been recognized by respected companies in the tech industry. He has made significant contributions during his tenure at Taiwan Semiconductor Manufacturing Company Limited, a leading semiconductor manufacturer known for cutting-edge fabrication processes. Doornbos also worked at NXP B.V., a prominent global semiconductor company specializing in secure connections and infrastructure solutions. His association with renowned industry players highlights his expertise and credibility within the field.

Collaborations and Contributions:

Throughout his career, Doornbos has had the opportunity to collaborate with accomplished professionals, including Mark van Dal and Matthias Passlack. These partnerships have led to the development of innovative technologies, further cementing his reputation as a valuable contributor to the semiconductor technology landscape.

Conclusion:

Gerben Doornbos' extensive patent portfolio, expertise in semiconductor design, and collaborations with industry leaders position him as a noteworthy figure in the field of semiconductor technologies. By consistently pushing boundaries and seeking novel solutions, he continues to contribute to advancements in the industry. Doornbos' work serves as an inspiration to aspiring inventors and reinforces the vital role of innovation in shaping the future of semiconductor devices.

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