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For the Inventor, By the Inventor

Hubei, China

Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.

USPTO Granted Patents = 18


Forward Citations = 0

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25 inventors (with patents filed for the assignee):

goldMedal Sheng Hu (6 out of 21 patents)

silverMedal Tianjian Liu (6 out of 12 patents)

bronzeMedal Guoliang Ye (5 out of 11 patents)

4.  Wanli Guo (3 out of 3 patents)

5.  Tian Zeng (3 out of 3 patents)

6.  Di Zhan (3 out of 3 patents)

7.  Fan Yang (2 out of 5 patents)

8.  Yuheng Huang (2 out of 2 patents)

9.  Daohong Yang (2 out of 2 patents)

10.  Peng Sun (2 out of 2 patents)

11.  Kaiwei Cao (2 out of 2 patents)

12.  Bang Chen (2 out of 2 patents)

13.  Yicheng Feng (2 out of 2 patents)

14.  Ning Wang (1 out of 3 patents)

15.  Jun Zhou (1 out of 4 patents)


18 patents:

1. 12765081 - Method of fabricating semiconductor device (2026-10-13),
2. 12749533 - 3D memory block having low-resistance source/drain buried layer stacked architecture (2026-09-29),
3. 12740461 - Chip packaging method and chip packaging structure (2026-09-15),
4. 12740381 - Method for stacking multi-layer wafers, and system for stacking mult-layer wafers (2026-09-15),
5. 12727486 - Wafer matching design method, wafer bonding structure and chip bonding structure (2026-09-01),
6. 12713934 - FIRST CHIP AND WAFER BONDING METHOD AND CHIP STACKING STRUCTURE (2026-08-18),
7. 12710697 - OVERLAY MARK, OVERLAY ERROR MEASUREMENT METHOD FOR WAFER, AND WAFER STACKING METHOD (2026-08-18),
8. 12707935 - Chip bonding method (2026-08-11),
9. 12701798 - Semiconductor device and method of fabricating the same (2026-08-04),
10. 12701771 - Method of manufacturing a three-dimensionally integrated structure having a clamping surface and a wafer stack with a chamfered surface (2026-08-04),
11. 12672577 - Semiconductor device and manufacturing method thereof (2026-06-30),
12. 12622073 - Hybrid image sensor having dies bonded to pixel substrate (2026-05-05),
13. 12615999 - Chip bonding method (2026-04-28),
14. 12610632 - Semiconductor device and manufacturing method therefor, and chip bonding structure (2026-04-21),
15. 12593148 - Active pixel circuit, image sensor, and electronic device (2026-03-31),
Company Overview
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. is a prominent player in the semiconductor industry, specializing in the design and fabrication of integrated circuits. The company focuses on advanced manufacturing technologies and aims to support various sectors, including telecommunications, consumer electronics, and automotive applications. Based in Hubei, China, Xinxin Semiconductor is committed to enhancing the local semiconductor ecosystem and driving innovation in electronic components, contributing to the broader technological landscape.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 20 2026

18 Patents

#5 in Hubei

#1,628 in China

#34,244 in the World

Hubei, CN
Hubei, China

Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.

Forward Citations = 0

25 inventors:

goldMedal Sheng Hu (6 out of 21 patents)

silverMedal Tianjian Liu (6 out of 12 patents)

bronzeMedal Guoliang Ye (5 out of 11 patents)

4.  Wanli Guo (3 out of 3 patents)

5.  Tian Zeng (3 out of 3 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.. Retrieved from https://idiyas.com/company/wuhan-xinxin-semiconductor-manufacturing

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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