The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Dec. 17, 2020
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd., Wuhan, CN;
Abstract
Disclosed in the present disclosure are a semiconductor device and manufacturing method thereof. The method comprises: bonding the front surface of a top wafer to the front surface of a first wafer, and enabling the front surface of the top wafer to face upwards and the front surface of the first wafer to face downwards; bonding the front surface of a second wafer to the back surface of the first wafer to form a bonding structure, and enabling the front surface of the second wafer to face downwards; flipping the bonding structure to enable the front surface of the first wafer and the front surface of the second wafer to face upwards, and forming a pad pin in a top chip substrate.