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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12615999 B1

PDFFull Text
Date of Patent:
Apr. 28, 2026

Filed:

Feb. 26, 2021

Chip bonding method

Applicant:

Wuhan Xinxin Semiconductor Manufacturing Co., Ltd., Wuhan, CN;

Inventors:

Wanli Guo, Wuhan, CN;

Tianjian Liu, Wuhan, CN;

Assignee:

WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD., Hubei, CN;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Vu A Vu

Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/02 (2006.01); H01L 21/60 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H10D 89/00 (2025.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); H01L 21/02076 (2013.01); H01L 21/60 (2021.08); H01L 21/76804 (2013.01); H01L 24/89 (2013.01); H10D 89/013 (2025.01); H01L 2221/68327 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/89 (2013.01); H01L 2924/37001 (2013.01);
Abstract

A die bonding method is disclosed, through coating bonding adhesive on front side of device wafer and bonding carrier wafer thereto, back-side connection structure can be formed on back side of device wafer to lead out an interconnect structure in device wafer to back side of device wafer, and dies thereon can be bonded at front sides to target wafer. Moreover, after device wafer is debonded from carrier wafer, the bonding adhesive is retained on front side of device wafer to provide protection to front side of device wafer during subsequent dicing of device wafer, and to avoid particles or etching by-products produced during dicing process from adhering to front side of device wafer. Such etching by-products are subsequently removed along with the bonding adhesive, ensuring cleanness of front sides of individual dies resulting from dicing process and improved quality of bonding of dies at front sides to target wafer.

Find Patent Forward Citations

Guo, Wanli. (2026). Chip bonding method (U.S. Patent No. 12615999). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12615999

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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