Wanli Guo

Title: Wanli Guo: Innovator in Semiconductor Technology

Introduction

Wanli Guo is a prominent inventor based in Wuhan, China. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His innovative work focuses on improving chip bonding methods, which are crucial for the advancement of electronic devices.

Latest Patents

One of Wanli Guo's latest patents is titled "First Chip and Wafer Bonding Method and Chip Stacking Structure." This patent describes a die bonding method that involves temporarily bonding a first carrier wafer to the front side of a device wafer. This process allows for the formation of a back-side connection structure on the device wafer, leading out an interconnect structure to the back side. Additionally, the method includes bonding a second carrier wafer to the back side of the device wafer, enabling the debonding of the first carrier wafer. After the debonding process, a second bonding adhesive is retained to protect the back side of the device wafer during subsequent dicing, preventing particles or etching by-products from adhering to it.

Career Highlights

Wanli Guo is currently employed at Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. His work at this company has positioned him as a key player in the semiconductor industry, where he continues to innovate and develop new technologies.

Collaborations

Some of Wanli Guo's notable coworkers include Tianjian Liu and Di Zhan. Their collaborative efforts contribute to the advancement of semiconductor technologies and innovations.

Conclusion

Wanli Guo's contributions to semiconductor technology through his patents and work at Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. highlight his role as an influential inventor in the field. His innovative methods are paving the way for future advancements in electronic devices.