Tianjian Liu

Title: Innovations of Tianjian Liu in Semiconductor Manufacturing

Introduction

Tianjian Liu is a prominent inventor based in Hubei, China. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 4 patents. His work focuses on enhancing wafer structures and improving manufacturing methods, which are crucial for the advancement of technology in this sector.

Latest Patents

Tianjian Liu's latest patents include innovative designs and methods that address key challenges in semiconductor fabrication. One of his notable patents is for a wafer structure and method for manufacturing the same. This invention involves bonding two wafers together, creating an opening that extends through a substrate. A concave-convex structure is formed in the dielectric layer under the opening, which enhances the contact surface area of the pad without increasing its floor space.

Another significant patent is for a multi-wafer stack structure and its fabrication method. This design allows for electrical connections between various interconnection layers and metal layers without the need for additional wire pressure welding space. By eliminating the silicon substrate, the overall device thickness is reduced, leading to decreased parasitic capacitance and power loss, while increasing transmission speed.

Career Highlights

Tianjian Liu is currently employed at Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. His work at this company has positioned him as a key player in the semiconductor industry, where he continues to innovate and push the boundaries of technology.

Collaborations

Tianjian Liu collaborates with talented individuals in his field, including Changlin Zhao and Xing Hu. These partnerships enhance the creative process and contribute to the successful development of new technologies.

Conclusion

Tianjian Liu's contributions to semiconductor manufacturing through his innovative patents demonstrate his expertise and commitment to advancing technology. His work not only improves existing processes but also paves the way for future developments in the industry.