The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
Dec. 14, 2020
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd., Hubei, CN;
Abstract
A semiconductor device and a manufacturing method therefor are disclosed, in which a first opening is formed in a first metal layer by etching away part of the first metal layer, and a second metal layer is filled in the first opening and is electrically connected to the remainder of the first metal layer. A TSV extends sequentially through a substrate and a partial thickness of a dielectric layer so that the second metal layer is exposed therein, and an interconnect layer in the TSV is electrically connected to the second metal layer. In this way, the first metal layer can be picked up as long as projections of the second metal layer and the interconnect layer on the substrate are encompassed within a projection of the first metal layer on the substrate, without any additional lateral area of the first metal layer being occupied by the TSV.