The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
Mar. 24, 2020
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd., Hubei, CN;
Abstract
A bonding structure and a manufacturing method therefor. A first hybrid bonding structure is formed on a first wafer; an interconnection structure and a second hybrid bonding structure are formed on the front surface of a second wafer. The first wafer and the second wafer are bonded by means of the first hybrid bonding structure and the second hybrid bonding structure, a gasket electrically connected to the interconnection structure is formed on the back surface of the second wafer, and the interconnection structure below the gasket and a second conductive bonding pad in the second hybrid bonding structure are provided in a staggered manner in the horizontal direction. According to the solution, the interconnection structure and the second conductive bonding pad are arranged in a staggered manner, so that recesses generated by structural stacking are avoided, and device failure caused by the recesses is further avoided.