Sheng Hu is a prominent inventor based in Hubei, China. He has made significant contributions to the field of semiconductor technology, holding a total of 15 patents. His innovative work focuses on enhancing the efficiency and reliability of semiconductor devices.

Latest Patents

One of Sheng Hu's latest patents is titled "Bonding structure and manufacturing method therefor." This invention describes a first hybrid bonding structure formed on a first wafer, along with an interconnection structure and a second hybrid bonding structure on a second wafer. The bonding process utilizes these structures to ensure a reliable connection, avoiding device failures caused by structural stacking. Another notable patent is for a "Semiconductor device and manufacturing method therefor." This patent outlines a method for creating a trench fill structure in a substrate's pixel region, which includes a high-k dielectric layer. The process aims to improve the performance of semiconductor devices by optimizing the arrangement of materials.

Career Highlights

Sheng Hu is currently employed at Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. His work at this company has positioned him as a key player in the semiconductor industry, contributing to advancements that benefit various applications.

Collaborations

Sheng Hu collaborates with talented individuals in his field, including Changlin Zhao and Jun Zhou. Their combined expertise fosters an environment of innovation and progress in semiconductor technology.

Conclusion

Sheng Hu's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to shape the future of the industry, ensuring advancements that enhance device performance and reliability.

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