Hubei, China

Sheng Hu

This inventor holds 21 USPTO granted patents and 23 published patent applications and 1 EPO patent, primarily in Semiconductor Fabrication. Top assignees: Wuhan Xinxin Semiconductor Manufacturing Co., Ltd., Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.. Active years: 2020-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sheng Hu. Retrieved from https://idiyas.com/inventor/sheng-hu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21 

% Patents Active = 100.0


Average Co-Inventor Count = 2.9

ph-index = 1

Forward Citations = 5(Granted Patents)


Location History:

  • Wuhan, CN (2020 - 2023)
  • Hubei, CN (2020 - 2023)

Company Filing History:


Years Active: 2020-2026

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Areas of Expertise:
Semiconductor Device
Chip Packaging
Wafer Bonding
Image Sensor
Integrated Circuit
Bonding Structure
Three-Dimensional Integration
Photoetching Process
Capacitive Chip Interconnection
Manufacturing Method
Multi-Layer Chip
Wafer Structure
21 patents (USPTO):Explore Patents

Title: Sheng Hu: Innovator in Semiconductor Technology

Introduction

Sheng Hu is a prominent inventor based in Hubei, China. He has made significant contributions to the field of semiconductor technology, holding a total of 21 patents. His innovative work focuses on enhancing the efficiency and reliability of semiconductor devices.

Latest Patents

One of Sheng Hu's latest patents is titled "Bonding structure and manufacturing method therefor." This invention describes a first hybrid bonding structure formed on a first wafer, along with an interconnection structure and a second hybrid bonding structure on a second wafer. The bonding process utilizes these structures to ensure a reliable connection, avoiding device failures caused by structural stacking. Another notable patent is for a "Semiconductor device and manufacturing method therefor." This patent outlines a method for creating a trench fill structure in a substrate's pixel region, which includes a high-k dielectric layer. The process aims to improve the performance of semiconductor devices by optimizing the arrangement of materials.

Career Highlights

Sheng Hu is currently employed at Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. His work at this company has positioned him as a key player in the semiconductor industry, contributing to advancements that benefit various applications.

Collaborations

Sheng Hu collaborates with talented individuals in his field, including Changlin Zhao and Jun Zhou. Their combined expertise fosters an environment of innovation and progress in semiconductor technology.

Conclusion

Sheng Hu's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to shape the future of the industry, ensuring advancements that enhance device performance and reliability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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