The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2021
Filed:
Sep. 26, 2019
Applicant:
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd., Hubei, CN;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/304 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/06 (2013.01); H01L 21/304 (2013.01); H01L 24/32 (2013.01); H01L 25/0657 (2013.01);
Abstract
A bonding structure and a method for manufacturing the bonding structure are provided. Multiple chips arranged in an array are formed on a surface of a wafer. Each of the chips includes a device structure, an interconnect structure electrically connected to the device structure, and a first package pad layer electrically connected to the interconnect structure. The first package pad layer is arranged at an edge region of the chip. A chip stack is obtained after bonding and cutting the multiple wafers, and the first package pad layer at the edge region of the chip is exposed.