The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2025
Filed:
May. 31, 2022
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd., Hubei, CN;
Abstract
A semiconductor device and a method of manufacturing the semiconductor device are disclosed. The method of manufacturing the semiconductor device includes: forming a trench fill structure in a pixel region of a substrate, where a high-k dielectric layer is sandwiched between a side wall of a fill material in the trench fill structure and the substrate; forming a plug structure in a pad region of the substrate; covering a surface of the substrate in the pixel region and the pad region with a buffer dielectric layer; etching the buffer dielectric layer to form first opening exposing at least part of the substrate around a top side wall portion of the trench fill structure and/or at least a top portion of the trench fill structure; and forming a metal grid layer on the buffer dielectric layer in the pixel region.