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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12431364 B1

PDFFull Text
Date of Patent:
Sep. 30, 2025

Filed:

Jun. 30, 2022

Method for manufacturing packaging enclosure and method for manufacturing packaging chip

Applicant:

Hubei Yangtze Pilot-line Services Co., Ltd., Hubei, CN;

Inventors:

Yiqun Wang, Wuhan, CN;

Song Wang, Wuhan, CN;

Yuan Sun, Wuhan, CN;

Tianjian Liu, Wuhan, CN;

Assignee:

Hubei Yangtze Pilot-Line Services Co., Ltd., Hubei, CN;

Attorneys:

Syncoda LLC

Feng Ma

Primary Examiner:

Jack S Chen

Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/481 (2013.01); H01L 21/52 (2013.01); H01L 23/04 (2013.01);
Abstract

A method for manufacturing a packaging enclosure includes the following operations. A substrate which has a first surface and a second surface opposite to each other, is provided. A hole of which the bottom is located in the substrate, is formed in the first surface of the substrate. The first surface of the substrate with the formed hole is bonded onto a carrier which covers the hole. A groove which is communicated with the hole in a direction perpendicular to the substrate, is formed in the second surface of the substrate after bonding the first surface onto the carrier. The second surface of the substrate with the formed groove is fixed to a bearing layer. The carrier is removed after fixing the second surface to the bearing layer. The bearing layer is removed after removing the carrier.

Find Patent Forward Citations

Wang, Yiqun. (2025). Method for manufacturing packaging enclosure and method for manufacturing packaging chip (U.S. Patent No. 12431364). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12431364

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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