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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Walsin Advanced Electronics Ltd.

Calculating rank
USPTO Granted Patents = 14

% Expired Patents = 35.7

Forward Citations = 807

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29 inventors (with patents filed for the assignee):

goldMedal Wen-Chun Liu (7 out of 8 patents)

silverMedal Chien-Hung Lai (4 out of 8 patents)

bronzeMedal Chang Chao-Chia (3 out of 3 patents)

4.  Lin Chien-Tsun (3 out of 3 patents)

5.  Su Chun-Jen (3 out of 3 patents)

6.  Chia-Yu Hung (2 out of 2 patents)

7.  Chun-Jen Su (2 out of 2 patents)

8.  Yi-Hsiang Pan (2 out of 2 patents)

9.  Tseng Ming-Hui (2 out of 2 patents)

10.  Su Yu-Hsien (2 out of 2 patents)

11.  Jung-Jie Liou (2 out of 2 patents)

12.  Chih-Kung Huang (1 out of 21 patents)

13.  Kuo-Yuan Lee (1 out of 6 patents)

14.  Ming-Feng Wu (1 out of 2 patents)

15.  Kevin Hsia (1 out of 1 patent)


14 patents:

1. 6762118 - Package having array of metal pegs linked by printed circuit lines (2004-07-13),
2. 6650005 - Micro BGA package (2003-11-18),
3. 6521485 - Method for manufacturing wafer level chip size package (2003-02-18),
4. 6486564 - Heat dissipation module for a BGA IC (2002-11-26),
5. 6459162 - Encapsulated semiconductor die package (2002-10-01),
6. 6459148 - QFN semiconductor package (2002-10-01),
7. 6437429 - Semiconductor package with metal pads (2002-08-20),
8. 6385049 - Multi-board BGA package (2002-05-07),
9. 6380624 - Stacked integrated circuit structure (2002-04-30),
10. 6380062 - Method of fabricating semiconductor package having metal peg leads and connected by trace lines (2002-04-30),
11. 6337510 - Stackable QFN semiconductor package (2002-01-08),
12. 6278182 - Lead frame type semiconductor package (2001-08-21),
13. 6204553 - Lead frame structure (2001-03-20),
14. 6078099 - Lead frame structure for preventing the warping of semiconductor package (2000-06-20),
Company Overview
Walsin Advanced Electronics Ltd. is a prominent player in the electronics manufacturing sector, specializing in the development and production of advanced electronic components. The company focuses on a range of technologies, including passive components such as resistors and capacitors, which are essential for various applications in consumer electronics, telecommunications, and automotive industries. Headquartered in Kaohsiung, Taiwan, Walsin is committed to innovation and quality, serving a global market with its cutting-edge solutions.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 27 2026

14 Patents

#36 in Kaohsiung

#1,115 in Taiwan

#42,312 in the World

Kaohsiung, TW
Kaohsiung, Taiwan

Walsin Advanced Electronics Ltd.

Forward Citations = 807

29 inventors:

goldMedal Wen-Chun Liu (7 out of 8 patents)

silverMedal Chien-Hung Lai (4 out of 8 patents)

bronzeMedal Chang Chao-Chia (3 out of 3 patents)

4.  Lin Chien-Tsun (3 out of 3 patents)

5.  Su Chun-Jen (3 out of 3 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Walsin Advanced Electronics Ltd.. Retrieved from https://idiyas.com/company/walsin-advanced-electronics

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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