The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2002
Filed:
Nov. 13, 2000
Su Chun-Jen, Kaohsiung, TW;
Lin Chien-Tsun, Kaohsiung, TW;
Chang Chao-Chia, Kaohsiung, TW;
Su Yu-Hsien, Kaohsiung, TW;
Tseng Ming-Hui, Kaohsiung, TW;
Abstract
A QFN semiconductor package comprises a semiconductor die, a lead frame, bonding wires and a molding compound. The die has an upward topside with a plurality of bonding pads. The lead frame consists of a plurality of inner leads, wherein each inner lead is divided into the front finger portion, the middle protruding portion and the rare connecting portion. The front finger portion is the position of the inner lead to which a bonding wire wire-bonds from the bonding pad of the die. The rare connecting portion is for the electrical out-connection of the package. The middle protruding portion is at height level higher than the front finger portion and the rare connecting portion. The bonding wires electrically connect the bonding pads of the die with the front finger portions of inner leads by means of wire-bonding. A molding compound seals off at least said bonding wires and at least exposes the downside of the die and some surface of the rare connecting portion of each inner lead, therefore improve stability of the inner lead whenever during wire-bonding or after encapsulating.