Chang Chao-Chia

Title: Chang Chao-Chia: Innovator in Semiconductor Packaging

Introduction

Chang Chao-Chia is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His innovative methods have advanced the technology used in chip manufacturing and packaging.

Latest Patents

One of his latest patents is a method for manufacturing a wafer level chip size package. This method involves securing a wafer to a partly etched lead frame, drilling a blind hole, and filling conductive material after packaging the lead frame. This process ensures an inner electrical connection of the wafer after packaging. Another notable patent is for a QFN semiconductor package. This package includes a semiconductor die, a lead frame, bonding wires, and a molding compound. The design features a plurality of bonding pads on the die and a lead frame with inner leads that facilitate electrical connections.

Career Highlights

Chang Chao-Chia works at Walsin Advanced Electronics Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in improving the stability and efficiency of semiconductor packages.

Collaborations

He collaborates with talented coworkers, including Lin Chien-Tsun and Su Yu-Hsien, who contribute to the innovative environment at Walsin Advanced Electronics Ltd.

Conclusion

Chang Chao-Chia's contributions to semiconductor packaging technology highlight his role as a leading inventor in the field. His patents reflect a commitment to advancing manufacturing methods and improving product reliability.