The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2003
Filed:
Jan. 17, 2001
Applicant:
Inventors:
Spencer Su, Kaohsiung, TW;
James Lai, Kaohsiung, TW;
Lin Chien-Tsun, Kaohsiung, TW;
Captain Chen, Tainan, TW;
Allen Chen, Kaohsiung, TW;
C.S. Yang, Kaohsiung, TW;
Chang Chao-Chia, Kaohsiung, TW;
Kevin Hsia, Kaohsiung, TW;
Assignee:
Walsin Advanced Electronics LTD, Kaohsiung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
Abstract
A method for manufacturing a wafer level chip size package and the method comprises the steps of: securing wafer to a partly etched lead frame, drilling blind hole and filling conductive material after packaging the lead frame to electrically connect the lead frame and the wafer, thus providing inner electrical connection of the wafer after packaging.