Kevin Hsia

Title: Kevin Hsia: Innovator in Wafer Level Chip Size Packaging

Introduction

Kevin Hsia is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of electronics, particularly in the manufacturing of wafer level chip size packages. His innovative approach has led to the development of a patented method that enhances the efficiency and effectiveness of electronic packaging.

Latest Patents

Kevin Hsia holds a patent for a "Method for manufacturing wafer level chip size package." This method involves several steps, including securing a wafer to a partly etched lead frame, drilling a blind hole, and filling conductive material after packaging the lead frame. This process ensures an inner electrical connection of the wafer after packaging, which is crucial for the functionality of electronic devices.

Career Highlights

Kevin is currently employed at Walsin Advanced Electronics Ltd., where he continues to push the boundaries of innovation in electronic packaging. His work has not only contributed to the company's success but has also set new standards in the industry.

Collaborations

Kevin collaborates with talented individuals such as Spencer Su and James Lai. Their combined expertise fosters a creative environment that drives innovation and enhances the development of new technologies.

Conclusion

Kevin Hsia's contributions to the field of wafer level chip size packaging exemplify the spirit of innovation. His patented method and ongoing work at Walsin Advanced Electronics Ltd. highlight his commitment to advancing technology in the electronics industry.