Su Yu-Hsien

Title: Innovations of Su Yu-Hsien in Semiconductor Packaging

Introduction

Su Yu-Hsien is an accomplished inventor based in Kaohsiung, Taiwan, with a focus on semiconductor packaging technologies. With two patents to his name, his contributions to the field have been significant, especially in the realm of QFN (Quad Flat No-lead) semiconductor packages.

Latest Patents

Su Yu-Hsien's latest innovations include the QFN semiconductor package and the stackable QFN semiconductor package. The QFN semiconductor package comprises a semiconductor die, a lead frame, bonding wires, and a molding compound. The design features an upward topside with a plurality of bonding pads, where the lead frame consists of inner leads that are intricately divided into front finger portions, middle protruding portions, and rare connecting portions. This innovative structure enhances the stability of the inner leads during the wire-bonding process and after encapsulation, ensuring a reliable electrical interconnection.

His second patent, the stackable QFN semiconductor package, introduces further advancements by incorporating a thicker body in the lead frame, which exposes both the upper and lower surfaces for outer electrical connections. The design features fingers extending from the body above the die's topside, allowing for efficient electrical connections. The molding compound seals off the electrical connection devices, providing a thinner package that offers the option for stacking.

Career Highlights

Su Yu-Hsien is affiliated with Walsin Advanced Electronics Ltd., a company known for its innovative advancements in electronics. His work in semiconductor packaging positions him as a key player in the development of efficient and effective solutions for modern electronics.

Collaborations

Throughout his career, Su has collaborated with notable colleagues including Su Chun-Jen and Lin Chien-Tsun. Lin, a talented woman in the field, has contributed to the collaborative environment that fosters innovation and creativity in their projects.

Conclusion

In conclusion, Su Yu-Hsien’s contributions to the field of semiconductor packaging demonstrate his dedication to advancing technology. His patents reflect a commitment to innovation, enhancing the efficiency and reliability of electronic components. As the industry continues to evolve, inventors like Su play a crucial role in driving progress and shaping the future of electronics.