Chun-Jen Su

Title: Innovations of Chun-Jen Su

Chun-Jen Su is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of electronics, particularly in semiconductor packaging. With a total of 2 patents, his work showcases innovative solutions that enhance the performance and reliability of electronic devices.

Latest Patents

One of Chun-Jen Su's latest patents is the Micro BGA package. This invention comprises a die, a wiring board, a plurality of metal bonding wires, a plurality of solder balls, and a package body. The wiring board features a die-attaching surface, a surface-mounting surface with solder balls, and lateral surfaces connecting the two. The package body includes a fastener that covers and extends around the lateral surfaces of the wiring board, improving the bonding strength between the wiring board and die while preventing delamination. Additionally, the wiring board is designed with support bars to provide stability during the molding process.

Another significant patent is for a semiconductor package with metal pads, applicable to QFN and SON types. This semiconductor package includes a die, a protective package body, and multiple leads. Each lead features a metal pad formed on its partial downside surface, ensuring coplanarity with the package body. The design incorporates a cutting surface exposed on the lateral surface of the package body, which is engineered to avoid sharp edges after cutting, enhancing safety and functionality.

Career Highlights

Chun-Jen Su is currently employed at Walsin Advanced Electronics Ltd., where he continues to innovate in the field of semiconductor technology. His work has contributed to advancements in electronic packaging, making devices more efficient and reliable.

Collaborations

Chun-Jen Su collaborates with talented coworkers, including Chien-Hung Lai and Chien-Tsun Lin. Their combined expertise fosters a creative environment that drives innovation in their projects.

Conclusion

Chun-Jen Su's contributions to semiconductor packaging through his patents reflect his commitment to advancing technology in electronics. His innovative designs not only improve product performance but also enhance the overall reliability of electronic devices.