The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2000
Filed:
Feb. 16, 1999
Applicant:
Inventors:
Assignee:
Walsin Advanced Electronics LTD, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257676 ; 257666 ;
Abstract
A lead frame structure can prevent the warping of a semiconductor package body. The lead frame has a downset die pad and upset internal leads so that packaging material can be evenly distributed both above and below the lead frame.
Liu, Wen-Chun. (2000). Lead frame structure for preventing the warping of semiconductor package (U.S. Patent No. 6078099). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6078099
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile