Hsinchu, Taiwan

Chih-Kung Huang

USPTO Granted Patents = 20 

Average Co-Inventor Count = 2.4

ph-index = 7

Forward Citations = 132(Granted Patents)


Location History:

  • Yi-Lang, TW (2001 - 2003)
  • Yi-Lan, TW (2001 - 2004)
  • Hsinchu City, TW (2010)
  • Hsinchu City 300, TW (2010)
  • Taipei County, TW (2013)
  • Hsinchu, TW (1999 - 2024)

Company Filing History:


Years Active: 1999-2025

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20 patents (USPTO):

Title: Chih-Kung Huang: A Pioneer in Chip Packaging Innovations

Introduction

Chih-Kung Huang, based in Hsinchu, Taiwan, is a prominent inventor with an impressive portfolio of 19 patents. His contributions to the field of semiconductor packaging have significantly impacted the industry, showcasing his innovative spirit and technical expertise.

Latest Patents

Huang's recent patents demonstrate his commitment to advancing chip packaging technology. One notable invention is the "Structure and formation method of chip package with protective lid." This innovative method outlines the process of disposing a chip structure over a substrate and forming a first adhesive element directly on the chip structure, which boasts a specific thermal conductivity. Additionally, he details a second adhesive element with greater thermal conductivity, ensuring effective attachment of a protective lid to the chip assembly.

Another significant patent is the "Semiconductor device and method of manufacture," which introduces a device comprising a substrate supporting a die. Surrounding the die is a molding compound that features a structural interface, adding a new dimension to device architecture and reliability.

Career Highlights

Throughout his career, Chih-Kung Huang has collaborated with notable companies, including Sitron Precision Co., Ltd. His expertise in semiconductor technologies has made a profound impact, resulting in innovations that enhance efficiency and performance in electronic devices.

Collaborations

Huang has worked alongside esteemed colleagues such as Wei-Jen Lai and Shu-Hua Tseng. Their collaborative efforts have fostered an environment of creativity and excellence in research and development, pushing the boundaries of what is possible in semiconductor design and packaging.

Conclusion

Chih-Kung Huang's innovative contributions to the field of semiconductor packaging showcase his role as a significant inventor. With 19 patents to his name, he continues to inspire future generations in the realm of technology, driving progress and innovation in the semiconductor industry. His work not only demonstrates technical ingenuity but also reflects a commitment to enhancing the functionality and reliability of electronic devices worldwide.

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