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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chih-Kung Huang

This inventor holds 21 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Sitron Precision Co., Ltd., Kingtron Electronics Co., Ltd.. Active years: 1999-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Kung Huang. Retrieved from https://idiyas.com/inventor/chih-kung-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21 

% Patents Active = 76.2

Average Co-Inventor Count = 2.4

ph-index = 7

Forward Citations = 134(Granted Patents)


Location History:

  • Yi-Lang, TW (2001 - 2003)
  • Yi-Lan, TW (2001 - 2004)
  • Hsinchu City, TW (2010)
  • Hsinchu City 300, TW (2010)
  • Taipei County, TW (2013)
  • Hsinchu, TW (1999 - 2024)

Company Filing History:

goldMedal6 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal4 out of 4 
 
Sitron Precision Co., Ltd.
 patents
bronzeMedal2 out of 2 
 
Kingtron Electronics Co., Ltd.
 patents
4. 1 out of 6 
 
Domintech Co., Ltd.
 patents
5. 1 out of 53 
 
Fu Sheng Industrial Co., Ltd
 patents
6. 1 out of 14 
 
Walsin Advanced Electronics Ltd.
 patents
7. 7 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 1999-2026

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Areas of Expertise:
Chip Scale Package
Lead Frame
Thermal Interface Material
MEMS Sensor
Light-Emitting Element
Bonding Pad
Dual-Chip Packaging
Base Substrate
21 patents (USPTO):Explore Patents
1. 12757797 - Package structure with protective lid (2026-10-06),
2. 12374600 - Dam structure on lid to constrain a thermal interface material in a semiconductor device package structure and methods for forming the same (2025-07-29),
3. 11978715 - Structure and formation method of chip package with protective lid (2024-05-07),
4. 11328971 - Semiconductor device and method of manufacture (2022-05-10),
5. 10727147 - Semiconductor device and method of manufacture (2020-07-28),
6. 10109547 - Semiconductor device and method of manufacture (2018-10-23),
7. 8468888 - MEMS sensor capable of sensing acceleration and pressure (2013-06-25),
8. 7737452 - Light-emitting element package and light source apparatus using the same (2010-06-15),
9. 7675159 - Base substrate for chip scale packaging (2010-03-09),
10. 7122124 - Method of fabricating film carrier (2006-10-17),
11. 6677055 - Tape structure and manufacturing method (2004-01-13),
12. 6521521 - Bonding pad structure and method for fabricating the same (2003-02-18),
13. 6392305 - Chip scale package of semiconductor (2002-05-21),
14. 6344687 - Dual-chip packaging (2002-02-05),
15. 6262475 - Lead frame with heat slug (2001-07-17),

Title: Chih-Kung Huang: A Pioneer in Chip Packaging Innovations

Introduction

Chih-Kung Huang, based in Hsinchu, Taiwan, is a prominent inventor with an impressive portfolio of 19 patents. His contributions to the field of semiconductor packaging have significantly impacted the industry, showcasing his innovative spirit and technical expertise.

Latest Patents

Huang's recent patents demonstrate his commitment to advancing chip packaging technology. One notable invention is the "Structure and formation method of chip package with protective lid." This innovative method outlines the process of disposing a chip structure over a substrate and forming a first adhesive element directly on the chip structure, which boasts a specific thermal conductivity. Additionally, he details a second adhesive element with greater thermal conductivity, ensuring effective attachment of a protective lid to the chip assembly.

Another significant patent is the "Semiconductor device and method of manufacture," which introduces a device comprising a substrate supporting a die. Surrounding the die is a molding compound that features a structural interface, adding a new dimension to device architecture and reliability.

Career Highlights

Throughout his career, Chih-Kung Huang has collaborated with notable companies, including Sitron Precision Co., Ltd. His expertise in semiconductor technologies has made a profound impact, resulting in innovations that enhance efficiency and performance in electronic devices.

Collaborations

Huang has worked alongside esteemed colleagues such as Wei-Jen Lai and Shu-Hua Tseng. Their collaborative efforts have fostered an environment of creativity and excellence in research and development, pushing the boundaries of what is possible in semiconductor design and packaging.

Conclusion

Chih-Kung Huang's innovative contributions to the field of semiconductor packaging showcase his role as a significant inventor. With 19 patents to his name, he continues to inspire future generations in the realm of technology, driving progress and innovation in the semiconductor industry. His work not only demonstrates technical ingenuity but also reflects a commitment to enhancing the functionality and reliability of electronic devices worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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