The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2004
Filed:
Jun. 21, 2002
Applicant:
Inventors:
Chin-Fu Chung, Hsinchu, TW;
Chih-Kung Huang, Yi-Lan, TW;
Assignee:
Kingtron Electronics Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 1/501 ;
U.S. Cl.
CPC ...
B32B 1/501 ;
Abstract
A tape structure and method of fabricating the tape structure. The method includes plating a metal such as silver, bismuth, gold, magnesium, nickel, or palladium over leads so that recess cavities and whiskers on the leads are greatly reduced.
Chung, Chin-Fu. (2004). Tape structure and manufacturing method (U.S. Patent No. 6677055). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6677055
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile