The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2003
Filed:
Mar. 09, 2000
Applicant:
Inventors:
Chih-Kung Huang, Yi-Lang, TW;
Ying-Chih Chen, Tai Chung, TW;
Assignee:
FU Sheng Industrial Co., Ltd., Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
A bonding pad structure. A substrate having a first surface and a second surface is provided. A metal bonding pad and a bonding region are respectively located on the first surface and the second surface. Intermediate plated layers located are on the metal bonding pad and the bonding region. Under ball metallurgy layers are located on each of the intermediate plated layers such that each of the under ball metallurgy layers comprises a first plated layer and a second plated layer.