Chia-Yu Hung

Title: Chia-Yu Hung: Innovator in Microelectronics

Introduction

Chia-Yu Hung is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of microelectronics, holding a total of 2 patents. His innovative designs focus on improving the efficiency and reliability of electronic packaging.

Latest Patents

One of his latest patents is the Micro BGA package. This invention comprises a die, a wiring board, a plurality of metal bonding wires, a plurality of solder balls, and a package body. The wiring board features a die-attaching surface, a surface-mounting surface with solder balls, and lateral surfaces connecting the two. The package body includes a fastener that enhances the bonding strength between the wiring board and the die, effectively preventing delamination. Additionally, the wiring board is designed with support bars to provide stability during the molding process.

Another notable patent is the Stacked Integrated Circuit Structure. This structure involves stacking the main package bodies of multiple integrated circuits on top of one another. Connections between the leads of these stacked circuits are facilitated by a stacking substrate. Each surface of the stacking substrate is equipped with terminals that are electrically connected to corresponding terminals. The substrate also contains through vias that connect to these terminals. For two stacked integrated circuits, a hole can be defined in the stacking substrate to accommodate the main package body of one of the circuits, thereby reducing the overall thickness of the stacked assembly.

Career Highlights

Chia-Yu Hung is currently employed at Walsin Advanced Electronics Ltd., where he continues to innovate in the field of microelectronics. His work has significantly impacted the design and functionality of electronic components.

Collaborations

He has collaborated with notable coworkers, including Chun-Jen Su and Chien-Hung Lai, contributing to various projects that enhance the capabilities of electronic packaging.

Conclusion

Chia-Yu Hung's contributions to microelectronics through his patents and collaborative efforts highlight his role as a key innovator in the industry. His work continues to influence the development of advanced electronic packaging solutions.