Yi-Hsiang Pan

Title: Innovations of Yi-Hsiang Pan

Introduction

Yi-Hsiang Pan is a notable inventor based in Feng Shan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative spirit and technical expertise.

Latest Patents

One of Yi-Hsiang Pan's latest patents is a heat dissipation module for a BGA IC. This improved module is designed to enhance heat dissipation in encapsulated IC devices. It features a thin metal structure with an annular base and several supports extending from its inner rim to support a top plate. The design includes at least one protruding annular ring on the top surface of the plate, ensuring a proper match during the encapsulation process. This innovation helps to avoid glue overflow issues and increases the total dissipation area, facilitating better heat management.

Another significant patent by Yi-Hsiang Pan is a lead frame structure for semiconductor packages. This lead frame includes a die pad and multiple leads. One surface of the die pad supports a silicon chip, while the opposite surface features several annular grooves with a common geometric center. The inner lead portion surrounds the die pad, with the die pad and leads positioned on different planar surfaces, enhancing the overall functionality of the semiconductor package.

Career Highlights

Yi-Hsiang Pan is currently employed at Walsin Advanced Electronics Ltd., where he continues to develop innovative solutions in the semiconductor industry. His work has contributed to advancements in heat dissipation technologies and semiconductor packaging.

Collaborations

Some of Yi-Hsiang Pan's coworkers include Wen-Chun Liu and Hui-Ping Liu, who collaborate with him on various projects within the company.

Conclusion

Yi-Hsiang Pan's contributions to semiconductor technology through his patents reflect his dedication to innovation and excellence in his field. His work continues to influence the industry positively.