Walsin Advanced Electronics Ltd.

Yi-Hsiang Pan

Wen-Chun Liu

Kuo-Yuan Lee

Jung-Jie Liou

Hui-Ping Liu

Sheng-Tung Tsai

An improved heat dissipation module for BGA IC's is a thin metal module used for heat dissipation in an encapsulated IC device. It has an annular base with several supports extending from its inner rim upwards to support a top plate. At least one protruding annular ring is provided on the top surface of the top plate. This design can ensure the top plate and a mold match during the capsulation process, avoid the glue overflow problem, and increase its total dissipation area to facilitate heat dissipation.

Heat dissipation module for a BGA IC

A lead frame for a semiconductor package. The lead frame includes a die pad and a plurality of leads. One surface of the die pad supports a silicon chip while the other surface has a plurality of annular grooves all having the same geometric center. The inner lead portion of the leads surrounds the die pad, but the die pad and the leads are on different planar surfaces.

Growing community of inventors

Feng Shan, Taiwan

Yi-Hsiang Pan