The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2002
Filed:
Mar. 27, 2001
Abstract
A semiconductor die package has a lead frame, a die attached to the lead frame and an encapsulant enclosing the lead frame and the die. The distance between the top outside face of the encapsulant and the frame is substantially equal to the distance between the bottom outside face of the encapsulant and the die, and the distance between the top outside face of the encapsulant and the frame is substantially two and half times the distance between the bottom outside face of the encapsulant and the lead frame. Consequently, the different thickness of different encapsulant portions achieves an optimum balance during curing that effectively reduces the deformation of the encapsulant. In addition, the encapsulant can be completely formed by an injection process, and no crack will form in the encapsulant.