IDiyas

For the Inventor, By the Inventor

Kanagawa-pref, Taiwan

Speedfam Co Ltd


USPTO Granted Patents = 57


Forward Citations = 698


where 'Filed Patents' based on already Granted Patents

where 'Inventors Filed' based on already Granted Patents


61 inventors (with patents filed for the assignee):

goldMedal Hatsuyuki Arai (11 out of 12 patents)

silverMedal Shunji Hakomori (10 out of 18 patents)

bronzeMedal Michihiko Yanagisawa (10 out of 19 patents)

4.  Misuo Sugiyama (6 out of 6 patents)

5.  Shigeto Izumi (5 out of 5 patents)

6.  Tadayoshi Okuya (4 out of 4 patents)

7.  Shinya Iida (4 out of 12 patents)

8.  Isao Nagahashi (4 out of 9 patents)

9.  Yusuke Inoue (3 out of 4 patents)

10.  Hitoshi Nagayama (3 out of 3 patents)

11.  Xu-Jin Wang (3 out of 3 patents)

12.  Hideo Tanaka (3 out of 3 patents)

13.  Hiroshi Yashiki (3 out of 4 patents)

14.  Seiichi Maeda (3 out of 3 patents)

15.  Kiyoshi Ikemoto (3 out of 3 patents)


57 patents:

1. 11145492 - Local dry etching apparatus (2021-10-12),
2. 8114178 - Polishing composition for semiconductor wafer and polishing method (2012-02-14),
3. 7147541 - Thickness control method and double side polisher (2006-12-12),
4. 7137867 - Thickness control method and double side polisher (2006-11-21),
5. 7094355 - Local dry etching method (2006-08-22),
6. 7005032 - Wafer table for local dry etching apparatus (2006-02-28),
7. 6908566 - Local dry etching method (2005-06-21),
8. 6875701 - Nanotopography removing method (2005-04-05),
9. 6840841 - Wafer edge polishing system (2005-01-11),
10. 6773335 - Apparatus for polishing periphery of device wafer and polishing method (2004-08-10),
11. 6649528 - Local dry etching method (2003-11-18),
12. 6638147 - Polishing method for removing corner material from a semi-conductor wafer (2003-10-28),
13. 6478660 - Apparatus of and method for polishing the outer circumferential portions of a circular plate-shaped work (2002-11-12),
14. 6432824 - Method for manufacturing a semiconductor wafer (2002-08-13),
15. 6429399 - Discharge tube for a local etching apparatus and a local etching apparatus using the discharge tube (2002-08-06),
Speedfam Co Ltd is a leading manufacturer of precision surfacing equipment and consumables for semiconductor, MEMS, optical, and precision optics industries. With over 60 years of experience, Speedfam is dedicated to providing high-quality solutions for surface processing and finishing applications.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 2 2025

57 Patents

#1 in Kanagawa-pref

#11 in Taiwan

#12,147 in the World

...
Kanagawa-pref, Taiwan

Speedfam Co Ltd

Forward Citations = 698

61 inventors:

goldMedal Hatsuyuki Arai (11 out of 12 patents)

silverMedal Shunji Hakomori (10 out of 18 patents)

bronzeMedal Michihiko Yanagisawa (10 out of 19 patents)

4.  Misuo Sugiyama (6 out of 6 patents)

5.  Shigeto Izumi (5 out of 5 patents)

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