For the Inventor, By the Inventor

Enter assignee name

Shin-etsu Handotai Co., Ltd.

USPTO Granted Patents = 1,100

EPO Patents = 183

Trademarks = 2

Forward Citations = 9,553

Loading Chart...

Loading Chart...

685 inventors (with patents filed for the assignee):

Norihiro Kobayashi (53 out of 54 patents)

Izumi Fusegawa (47 out of 47 patents)

Kiyoshi Mitani (45 out of 53 patents)

4. Masanori Kimura (45 out of 46 patents)

5. Hiroji Aga (42 out of 45 patents)

6. Eiichi Iino (40 out of 41 patents)

7. Hisashi Masumura (38 out of 38 patents)

8. Ryoji Hoshi (37 out of 37 patents)

9. Nobuhiko Noto (35 out of 36 patents)

10. Hideo Kudo (35 out of 37 patents)

11. Makoto Iida (35 out of 36 patents)

12. Hirotoshi Yamagishi (35 out of 37 patents)

13. Isao Yokokawa (32 out of 32 patents)

14. Takao Abe (32 out of 36 patents)

15. Tomohiko Ohta (32 out of 32 patents)

Core Competencies:

Thermal Oxide Film

Single Crystal Manufacturing

Wafer Polishing

Epitaxial Wafer Cleaning

Silicon Carbide Defects

Quantum Computing Semiconductors

Solar Cell Structures

Double-Side Polishing

Silicon Single Crystal Wafer

Bonded SOI Wafer

Wire Saw Apparatus

Semiconductor Phosphor

1,100 patents: Sort by Forward Citations

1. 12500077 - Epitaxial wafer cleaning method (2025-12-16),

2. 12482647 - Method for forming thermal oxide film on semiconductor substrate (2025-11-25),

3. 12474275 - Inspection apparatus and inspection method (2025-11-18),

4. 12454767 - Single crystal manufacturing apparatus (2025-10-28),

5. 12449378 - Edge portion measuring apparatus and method for measuring edge portion (2025-10-21),

6. 12444597 - Epitaxial wafer cleaning method (2025-10-14),

7. 12440943 - Method and apparatus for polishing wafer (2025-10-14),

8. 12438101 - Bonded semiconductor light-receiving device and method for manufacturing bonded semiconductor light-receiving device (2025-10-07),

9. 12387126 - Method for producing semiconductor apparatus for quantum computer (2025-08-12),

10. 12377509 - Manufacturing method for a substrate wafer (2025-08-05),

11. 12368107 - Method for producing semiconductor apparatus and semiconductor apparatus (2025-07-22),

12. 12345660 - Method for evaluating crystal defects in silicon carbide single crystal wafer (2025-07-01),

13. 12345659 - Method for measuring DIC defect shape on silicon wafer and polishing method (2025-07-01),

14. 12308225 - Method for forming thermal oxide film on semiconductor substrate (2025-05-20),

15. 12300553 - Method for evaluating semiconductor wafer, method for selecting semiconductor wafer and method for fabricating device (2025-05-13),

Established in 1960, SHIN-ETSU HANDOTAI CO., LTD. is a leading manufacturer of silicon wafers used in the production of semiconductors. With a strong emphasis on research and development, the company has become a global leader in the semiconductor industry, providing high-quality silicon wafers to major semiconductor manufacturers worldwide. SHIN-ETSU HANDOTAI strives to innovate and contribute to technological advancements in order to meet the ever-increasing demand for advanced semiconductors in various industries.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

1,100 Patents

#96 in Tokyo

#206 in Japan

#910 in the World

Shin-etsu Handotai Co., Ltd.

Forward Citations = 9,553

685 inventors:

Norihiro Kobayashi (53 out of 54 patents)

Izumi Fusegawa (47 out of 47 patents)

Kiyoshi Mitani (45 out of 53 patents)

4. Masanori Kimura (45 out of 46 patents)

5. Hiroji Aga (42 out of 45 patents)

Please report any incorrect information to support@idiyas.com

Loading…