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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12440943 B1

PDFFull Text
Date of Patent:
Oct. 14, 2025

Filed:

Feb. 08, 2021

Method and apparatus for polishing wafer

Applicant:

Shin-etsu Handotai Co., Ltd., Tokyo, JP;

Inventors:

Masaaki Oseki, Nishigo-mura, JP;

Tatsuo Abe, Shirakawa, JP;

Michito Sato, Nishigo-mura, JP;

Assignee:

SHIN-ETSU HANDOTAI CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Jiong-Ping Lu

Int. Cl.
CPC ...
B24B 37/04 (2012.01); B24B 37/005 (2012.01); B24B 49/02 (2006.01); B24B 49/04 (2006.01); B24B 57/02 (2006.01); C09G 1/02 (2006.01); H01L 21/02 (2006.01); H01L 21/304 (2006.01); H01L 21/306 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B24B 37/044 (2013.01); B24B 37/005 (2013.01); B24B 37/042 (2013.01); B24B 49/02 (2013.01); B24B 49/04 (2013.01); B24B 57/02 (2013.01); C09G 1/02 (2013.01); H01L 21/02024 (2013.01); H01L 21/304 (2013.01); H01L 21/30625 (2013.01); H01L 21/67092 (2013.01);
Abstract

A method for polishing a wafer in order to correct a shape of a polished wafer subjected to polishing, by pressing the wafer to a polishing pad while continuously supplying a composition for polishing containing water to perform correction-polishing, the method including the steps of: measuring the shape of the polished wafer before performing the correction-polishing; determining, in accordance with the measured shape of the polished wafer, a kind and concentration of a surfactant to be contained in the composition for polishing; and performing the correction-polishing while supplying the composition for polishing adjusted on a basis of the determined kind and concentration of the surfactant. This provides a method and apparatus for polishing a wafer that make it possible to reduce, in the latter polishing step, a variation in the shape of the wafer that occurred in a preceding polishing step.

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