The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Jun. 08, 2021
Applicant:
Shin-etsu Handotai Co., Ltd., Tokyo, JP;
Inventor:
Junya Ishizaki, Takasaki, JP;
Assignee:
SHIN-ETSU HANDOTAI CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H10F 71/00 (2025.01); H10F 77/124 (2025.01); H10F 77/70 (2025.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H10F 71/1272 (2025.01); H10F 71/139 (2025.01); H10F 77/1248 (2025.01); H10F 77/703 (2025.01); H10F 77/707 (2025.01);
Abstract
A bonded semiconductor light-receiving device including an epitaxial layer to serve as a device-functional layer, and a support substrate made of a material different from that of the device-functional layer and bonded to the epitaxial layer via a bonding material layer. The device-functional layer has a bonding surface with an uneven pattern formed thereon.