The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Sep. 13, 2021
Applicant:

Shin-etsu Handotai Co., Ltd., Tokyo, JP;

Inventors:

Norimichi Tanaka, Annaka, JP;

Hisashi Masumura, Yabuki-machi, JP;

Teppei Nakata, Takasaki, JP;

Yuhei Fukazu, Takasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C30B 25/20 (2006.01); C30B 33/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0209 (2013.01); C30B 33/00 (2013.01); H01L 21/02057 (2013.01); H01L 21/02087 (2013.01); H01L 21/67046 (2013.01); C30B 25/20 (2013.01); H01L 21/67051 (2013.01);
Abstract

An epitaxial wafer cleaning method for cleaning a wafer having an epitaxial film formed on a front surface thereof, including: a first cleaning step of supplying a cleaning solution containing Oto all surfaces, including front, back, and end surfaces, of the wafer to perform spin cleaning; a second cleaning step of supplying a cleaning solution to the back and end surfaces of the wafer to perform cleaning with a roll brush after the first cleaning step; a third cleaning step of supplying a cleaning solution containing Oto the front surface of the wafer to perform spin cleaning after the second cleaning step; and a fourth cleaning step of supplying a cleaning solution containing HF to the front surface of the wafer to perform spin cleaning after the third cleaning step.


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