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For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Flipchip International LLC


USPTO Granted Patents = 15

% Expired Patents = 20.0


Trademarks = 1

Forward Citations = 178

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19 inventors (with patents filed for the assignee):

goldMedal Guy F Burgess (5 out of 7 patents)

silverMedal Anthony Paul Curtis (5 out of 7 patents)

bronzeMedal Yuan Lu (5 out of 5 patents)

4.  Douglas M Scott (3 out of 3 patents)

5.  Reynante Alvarado (3 out of 3 patents)

6.  Richard Redburn (3 out of 3 patents)

7.  Peter Elenius (3 out of 10 patents)

8.  Michael E Johnson (3 out of 6 patents)

9.  Robert A Forcier (3 out of 13 patents)

10.  Michael R Johnson (2 out of 6 patents)

11.  Theodore Gerard Tessier (2 out of 11 patents)

12.  Ted Tessier (2 out of 2 patents)

13.  David Clark (1 out of 7 patents)

14.  Hong Yang (1 out of 22 patents)

15.  Eugene A Stout (1 out of 2 patents)


15 patents:

1. 9070747 - Electroplating using dielectric bridges (2015-06-30),
2. 9018750 - Thin film structure for high density inductors and redistribution in wafer level packaging (2015-04-28),
3. 8980743 - Method for applying a final metal layer for wafer level packaging and associated device (2015-03-17),
4. 8754524 - Wafer-level interconnect for high mechanical reliability applications (2014-06-17),
5. 8686556 - Wafer level applied thermal heat sink (2014-04-01),
6. 8446019 - Solder bump interconnect (2013-05-21),
7. 8188606 - Solder bump interconnect (2012-05-29),
8. 8143722 - Wafer-level interconnect for high mechanical reliability applications (2012-03-27),
9. 8058163 - Enhanced reliability for semiconductor devices using dielectric encasement (2011-11-15),
10. 7973418 - Solder bump interconnect for improved mechanical and thermo-mechanical performance (2011-07-05),
11. 7126164 - Wafer-level moat structures (2006-10-24),
12. 7118833 - Forming partial-depth features in polymer film (2006-10-10),
13. 7057292 - Solder bar for high power flip chips (2006-06-06),
14. 7011988 - Build-up structures with multi-angle vias for Chip to Chip interconnects and optical bussing (2006-03-14),
15. 6919508 - Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing (2005-07-19),
Company Overview
Flipchip International LLC, based in Phoenix, AZ, specializes in advanced semiconductor packaging solutions. The company focuses on innovative flip chip technology, which enhances the performance and efficiency of electronic devices. With a commitment to research and development, Flipchip International serves various sectors, including consumer electronics, telecommunications, and automotive industries. Their expertise in high-density interconnects and thermal management positions them as a key player in the evolving landscape of microelectronics.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 20 2026

15 Patents

#59 in Phoenix, AZ

#258 in Arizona

#21,068 in US

#39,959 in the World

Phoenix, AZ (US)
Phoenix, AZ, United States of America

Flipchip International LLC

Forward Citations = 178

19 inventors:

goldMedal Guy F Burgess (5 out of 7 patents)

silverMedal Anthony Paul Curtis (5 out of 7 patents)

bronzeMedal Yuan Lu (5 out of 5 patents)

4.  Douglas M Scott (3 out of 3 patents)

5.  Reynante Alvarado (3 out of 3 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Flipchip International LLC. Retrieved from https://idiyas.com/company/flipchip-international

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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