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Phoenix, AZ, United States of America

Flipchip International LLC

USPTO Granted Patents = 15

EPO Patents = 1

Trademarks = 2

Forward Citations = 176

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19 inventors (with patents filed for the assignee):

Guy F Burgess (5 out of 7 patents)

Anthony Paul Curtis (5 out of 7 patents)

Yuan Lu (5 out of 5 patents)

4. Douglas M Scott (3 out of 3 patents)

5. Reynante Alvarado (3 out of 3 patents)

6. Richard Redburn (3 out of 3 patents)

7. Peter Elenius (3 out of 10 patents)

8. Michael E Johnson (3 out of 6 patents)

9. Robert A Forcier (3 out of 13 patents)

10. Michael R Johnson (2 out of 6 patents)

11. Theodore Gerard Tessier (2 out of 11 patents)

12. Ted Tessier (2 out of 2 patents)

13. David Clark (1 out of 6 patents)

14. Hong Yang (1 out of 22 patents)

15. Eugene A Stout (1 out of 2 patents)

15 patents: Sort by Forward Citations

1. 9070747 - Electroplating using dielectric bridges (2015-06-30),

2. 9018750 - Thin film structure for high density inductors and redistribution in wafer level packaging (2015-04-28),

3. 8980743 - Method for applying a final metal layer for wafer level packaging and associated device (2015-03-17),

4. 8754524 - Wafer-level interconnect for high mechanical reliability applications (2014-06-17),

5. 8686556 - Wafer level applied thermal heat sink (2014-04-01),

6. 8446019 - Solder bump interconnect (2013-05-21),

7. 8188606 - Solder bump interconnect (2012-05-29),

8. 8143722 - Wafer-level interconnect for high mechanical reliability applications (2012-03-27),

9. 8058163 - Enhanced reliability for semiconductor devices using dielectric encasement (2011-11-15),

10. 7973418 - Solder bump interconnect for improved mechanical and thermo-mechanical performance (2011-07-05),

11. 7126164 - Wafer-level moat structures (2006-10-24),

12. 7118833 - Forming partial-depth features in polymer film (2006-10-10),

13. 7057292 - Solder bar for high power flip chips (2006-06-06),

14. 7011988 - Build-up structures with multi-angle vias for Chip to Chip interconnects and optical bussing (2006-03-14),

15. 6919508 - Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing (2005-07-19),

Flipchip International LLC is a global provider of advanced semiconductor packaging and interconnect technologies. With a focus on flip chip and wafer-level processing, they deliver innovative solutions for a wide range of industries, including automotive, telecommunications, consumer electronics, and more. Their expertise lies in designing, developing, and manufacturing high-performance packages that enable smaller form factors, higher functionality, and improved reliability for integrated circuits. Through their cutting-edge facilities and collaborative approach, Flipchip International remains at the forefront of the semiconductor packaging industry, delivering quality and value to their customers.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

15 Patents

#60 in Phoenix, AZ

#262 in Arizona

#20,436 in US

#38,730 in the World

Phoenix, AZ, United States of America

Flipchip International LLC

Forward Citations = 176

19 inventors:

Guy F Burgess (5 out of 7 patents)

Anthony Paul Curtis (5 out of 7 patents)

Yuan Lu (5 out of 5 patents)

4. Douglas M Scott (3 out of 3 patents)

5. Reynante Alvarado (3 out of 3 patents)

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