The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Mar. 07, 2013
Applicant:
Flipchip International, Llc, Phoenix, AZ (US);
Inventors:
Guy F. Burgess, Gilbert, AZ (US);
Shannon D. Buzard, Chandler, AZ (US);
Anthony P. Curtis, Queen Creek, AZ (US);
Douglas M. Scott, Phoenix, AZ (US);
Assignee:
FlipChip International LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/485 (2006.01); H01L 21/768 (2006.01); H01L 23/482 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/485 (2013.01); H01L 21/7685 (2013.01); H01L 23/3736 (2013.01); H01L 23/4827 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/13099 (2013.01); H01L 23/36 (2013.01);
Abstract
A wafer level semiconductor device and manufacturing method including providing a semiconductor device wafer substrate having a backside, applying to the backside a conductive metallization layer, and applying to the backside over the conductive metallization layer a protective metal layer of titanium, titanium alloys, nickel, nickel alloys, chromium, chromium alloys, cobalt. cobalt alloys, palladium, and palladium alloys.