Location History:
- Phoenix, AZ (US) (2011)
- Gilbert, AZ (US) (2012 - 2017)
Company Filing History:
Years Active: 2011-2017
Title: Guy F Burgess: Innovator in Semiconductor Technology
Introduction
Guy F Burgess is a notable inventor based in Gilbert, AZ (US), recognized for his contributions to semiconductor technology. With a total of 7 patents, he has made significant advancements in methods related to semiconductor fabrication.
Latest Patents
Among his latest patents, Burgess has developed innovative methods for forming pillar bumps on semiconductor wafers. This patent discloses techniques for creating a vertical metallic pillar that overlays an under bump metal pad, which is further situated on a semiconductor substrate. The process involves applying a discrete solder cap on the pillar's top surface, utilizing at least one photoresist layer. Additionally, he has patented a method for building vertical pillar interconnects, which includes forming a vertical pillar over a bond pad on a semiconductor substrate and applying a solder sphere in combination with solder paste or flux.
Career Highlights
Throughout his career, Guy F Burgess has worked with various companies, including Flipchip International LLC. His work has significantly impacted the semiconductor industry, particularly in enhancing the efficiency and reliability of interconnect technologies.
Collaborations
Burgess has collaborated with notable professionals in the field, including Anthony Paul Curtis and Theodore Gerard Tessier. These collaborations have contributed to the advancement of semiconductor technologies and innovations.
Conclusion
Guy F Burgess stands out as a prominent inventor in the semiconductor sector, with a focus on innovative methods that enhance the manufacturing process. His contributions continue to influence the industry and pave the way for future advancements.