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Gilbert, AZ, United States of America

Guy F Burgess

USPTO Granted Patents = 7 (Patent Applications = 2)

Average Co-Inventor Count = 4.7

ph-index = 3

Forward Citations = 40(Granted Patents)

Location History:

Phoenix, AZ (US) (2011)
Gilbert, AZ (US) (2012 - 2017)

Company Filing History:

Flipchip International LLC

2 out of 832,680

Other

patents

Years Active: 2011-2017

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7 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9831201 - Methods for forming pillar bumps on semiconductor wafers (2017-11-28),

2. 9627254 - Method for building vertical pillar interconnect (2017-04-18),

3. 9070747 - Electroplating using dielectric bridges (2015-06-30),

4. 8980743 - Method for applying a final metal layer for wafer level packaging and associated device (2015-03-17),

5. 8754524 - Wafer-level interconnect for high mechanical reliability applications (2014-06-17),

6. 8143722 - Wafer-level interconnect for high mechanical reliability applications (2012-03-27),

7. 8058163 - Enhanced reliability for semiconductor devices using dielectric encasement (2011-11-15),

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