The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2011

Filed:

Aug. 06, 2009
Applicants:

John J. H. Reche, Phoenix, AZ (US);

Michael E. Johnson, Phoenix, AZ (US);

Guy F. Burgess, Phoenix, AZ (US);

Anthony P. Curtis, Phoenix, AZ (US);

Stuart Lichtenthal, Phoenix, AZ (US);

Inventors:

John J. H. Reche, Phoenix, AZ (US);

Michael E. Johnson, Phoenix, AZ (US);

Guy F. Burgess, Phoenix, AZ (US);

Anthony P. Curtis, Phoenix, AZ (US);

Stuart Lichtenthal, Phoenix, AZ (US);

Assignee:

Flipchip International, LLC, Phoenix, AZ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and device for enhanced reliability for semiconductor devices using dielectric encasement is disclosed. The method and device are directed to improving the reliability of the solder joint that connects the integrated circuit (IC) chip to the substrate. The method comprises applying a layer of a photoimageable permanent dielectric material to a top surface of the semiconductor device, and patterning the layer of the photoimageable permanent dielectric material to have an opening over each feature. The method further comprises dispensing or stencil printing fluxing material into the permanent dielectric material openings, and applying solder, which contains no flux, to a top surface of the fluxing material. In one or more embodiments, the method further comprises heating the semiconductor device to a reflow temperature appropriate for the reflow of the solder, thereby causing the solder to conform to sidewalls of the permanent dielectric material openings to form a protective seal.


Find Patent Forward Citations

Loading…