Queen Creek, AZ, United States of America

Anthony Paul Curtis

This inventor holds 7 USPTO granted patents and 2 published patent applications. Top assignees: Flipchip International LLC, Other. Active years: 2011-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Anthony Paul Curtis. Retrieved from https://idiyas.com/inventor/anthony-paul-curtis

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7 

% Patents Active = 85.7

Average Co-Inventor Count = 4.7

ph-index = 3

Forward Citations = 40(Granted Patents)


Location History:

  • Phoenix, AZ (US) (2011)
  • Gilbert, AZ (US) (2012 - 2014)
  • Queen Creek, AZ (US) (2015 - 2017)

Company Filing History:


Years Active: 2011-2017

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7 patents (USPTO):Explore Patents

Title: Innovations by Anthony Paul Curtis

Introduction

Anthony Paul Curtis is a notable inventor based in Queen Creek, AZ (US). He holds a total of 7 patents that showcase his contributions to the field of semiconductor technology. His work primarily focuses on methods for enhancing the efficiency and effectiveness of semiconductor manufacturing processes.

Latest Patents

Among his latest patents, one significant innovation is titled "Methods for forming pillar bumps on semiconductor wafers." This patent discloses methods for creating a vertical metallic pillar that overlays an under bump metal pad, which is further situated over a semiconductor substrate. The process involves applying a discrete solder cap on the top surface of the pillar, defined by at least one photoresist layer. The method also includes heating a multi-element metallic paste that contains a variable amount of metallic powder, a melting point depressant, and a flux. This allows the metal powder to sinter, forming the metallic pillar while adhering it to the underbump metal pad.

Another noteworthy patent is the "Method for building vertical pillar interconnect." This exemplary method involves forming a vertical pillar that is either overlying or laterally displaced from a bond pad on a semiconductor substrate. It also includes applying a discrete solder sphere in combination with either a solder paste or flux on the top surface of the pillar. The method may involve different combinations of solder spheres and solder flux on the top surfaces of various pillars.

Career Highlights

Throughout his career, Anthony has worked with several companies, including Flipchip International LLC. His expertise in semiconductor technology has made him a valuable asset in the industry.

Collaborations

Anthony has collaborated with notable individuals such as Guy F Burgess and Theodore Gerard Tessier, contributing to advancements in semiconductor manufacturing.

Conclusion

Anthony Paul Curtis is a distinguished inventor whose innovations in semiconductor technology have significantly impacted the industry. His patents reflect a commitment to improving manufacturing processes and enhancing the capabilities of semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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