The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2012
Filed:
Oct. 04, 2007
Anthony Curtis, Gilbert, AZ (US);
Guy F. Burgess, Gilbert, AZ (US);
Michael Johnson, Tempe, AZ (US);
Ted Tessier, Chandler, AZ (US);
Yuan LU, Phoenix, AZ (US);
Anthony Curtis, Gilbert, AZ (US);
Guy F. Burgess, Gilbert, AZ (US);
Michael Johnson, Tempe, AZ (US);
Ted Tessier, Chandler, AZ (US);
Yuan Lu, Phoenix, AZ (US);
Flipchip International, LLC, Phoenix, AZ (US);
Abstract
An interconnect structure comprises a solder including nickel (Ni) and tin (Sn), with the nickel in a range of 0.01 to 0.20 percent by weight. The interconnect structure further includes an intermetallic compound (IMC) layer in contact with the solder. The (IMC) layer comprises a compound of copper and nickel.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile