Ted Tessier

Title: Ted Tessier: Innovator in Wafer-Level Interconnect Technology

Introduction

Ted Tessier is a notable inventor based in Chandler, AZ (US), recognized for his contributions to the field of interconnect technology. With a total of two patents to his name, Tessier has made significant advancements that enhance mechanical reliability in various applications.

Latest Patents

Tessier's latest patents focus on wafer-level interconnects designed for high mechanical reliability applications. The first patent describes an interconnect structure that includes a solder with nickel (Ni) in a range of 0.01 to 0.20 percent by weight. This structure also features an intermetallic compound (IMC) layer in contact with the solder, which comprises a compound of copper and nickel. The second patent similarly outlines an interconnect structure that incorporates solder containing both nickel and tin (Sn), with nickel again in the specified range. This design also includes an IMC layer made of copper and nickel, further emphasizing the innovative approach Tessier has taken in this field.

Career Highlights

Ted Tessier is currently employed at Flipchip International LLC, where he continues to develop and refine interconnect technologies. His work has positioned him as a key player in the industry, contributing to advancements that are critical for high-performance applications.

Collaborations

Throughout his career, Tessier has collaborated with notable colleagues, including Anthony Paul Curtis and Guy F Burgess. These partnerships have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies.

Conclusion

In summary, Ted Tessier is a distinguished inventor whose work in wafer-level interconnect technology has made a significant impact on the industry. His patents reflect a commitment to enhancing mechanical reliability, and his collaborations further underscore his role as a leader in innovation.