The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Mar. 11, 2015
Applicants:

Guy F. Burgess, Gilbert, AZ (US);

Theodore Gerard Tessier, Chandler, AZ (US);

Anthony Paul Curtis, Queen Creek, AZ (US);

Lillian Charell Thompson, Phoenix, AZ (US);

Inventors:

Guy F. Burgess, Gilbert, AZ (US);

Theodore Gerard Tessier, Chandler, AZ (US);

Anthony Paul Curtis, Queen Creek, AZ (US);

Lillian Charell Thompson, Phoenix, AZ (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/03426 (2013.01); H01L 2224/03452 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05171 (2013.01); H01L 2224/05172 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05671 (2013.01); H01L 2224/05672 (2013.01); H01L 2224/05684 (2013.01); H01L 2224/119 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11474 (2013.01); H01L 2224/11505 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/11902 (2013.01); H01L 2224/132 (2013.01); H01L 2224/133 (2013.01); H01L 2224/13006 (2013.01); H01L 2224/13007 (2013.01); H01L 2224/13012 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/1332 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/13301 (2013.01); H01L 2224/13305 (2013.01); H01L 2224/13309 (2013.01); H01L 2224/13311 (2013.01); H01L 2224/13313 (2013.01); H01L 2224/13316 (2013.01); H01L 2224/13318 (2013.01); H01L 2224/13324 (2013.01); H01L 2224/13339 (2013.01); H01L 2224/13344 (2013.01); H01L 2224/13347 (2013.01); H01L 2224/13355 (2013.01); H01L 2224/13364 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14051 (2013.01); H01L 2924/00015 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01031 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01048 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01083 (2013.01);
Abstract

The subject matter contained herein discloses methods for forming a vertical metallic pillar overlying an under bump metal pad further overlying a semiconductor substrate, and applying a discrete solder cap on a top surface of the pillar, wherein the metallic pillar is defined by at least one photoresist layer. The method includes heating a multi-element metallic paste containing a variable amount of metallic powder, a melting point depressant and a flux such that the metal powder sinters to form the metallic pillar and simultaneously adheres the metallic pillar to the underbump metal pad.


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