The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Sep. 27, 2013
Flipchip International, Llc, Phoenix, AZ (US);
Eugene A. Stout, Phoenix, AZ (US);
Douglas M. Scott, Phoenix, AZ (US);
Anthony P. Curtis, Queen Creek, AZ (US);
Theodore G. Tessier, Chandler, AZ (US);
Guy F. Burgess, Gilbert, AZ (US);
Flipchip International LLC, Phoenix, AZ (US);
Abstract
Structures and methods provide a dielectric bridge for use in electroplating. A method comprises: providing a semiconductor wafer with a plurality of die, wherein a first die is adjacent to a second die, and the first die and second die are separated by a dicing street area; forming a patterned dielectric layer overlying the semiconductor wafer, the dielectric layer including a dielectric bridge that crosses the dicing street area; forming a conductive layer (e.g., a metal seed layer) overlying the dielectric layer, wherein a portion of the conductive layer is overlying the dielectric bridge to provide a current pathway from the first die to the second die; and electroplating targeted areas of the conductive layer by providing current to the second die using the current pathway. Other such bridges formed from the dielectric layer provide current pathways to other die on the wafer.