Shannon D Buzard

Title: Shannon D Buzard: Innovator in Wafer Level Packaging Technology

Introduction

Shannon D Buzard is a prominent inventor based in Chandler, AZ (US). She has made significant contributions to the field of semiconductor technology, particularly in wafer level packaging. Her innovative approach has led to advancements that enhance the efficiency and reliability of semiconductor devices.

Latest Patents

Shannon holds a patent for a "Method for applying a final metal layer for wafer level packaging and associated device." This patent describes a manufacturing method that includes providing a semiconductor device wafer substrate with a backside, applying a conductive metallization layer, and then applying a protective metal layer over it. The protective layer can consist of materials such as titanium, nickel, chromium, cobalt, and palladium, among others. This innovation is crucial for improving the performance and durability of semiconductor devices.

Career Highlights

Shannon is currently employed at Flipchip International LLC, where she continues to develop cutting-edge technologies in semiconductor manufacturing. Her work has been instrumental in advancing the capabilities of wafer level packaging, which is essential for modern electronic devices.

Collaborations

Shannon has collaborated with notable professionals in her field, including Guy F Burgess and Anthony Paul Curtis. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Shannon D Buzard is a trailblazer in the semiconductor industry, with her patent and work at Flipchip International LLC showcasing her commitment to innovation. Her contributions are paving the way for future advancements in wafer level packaging technology.