The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2014
Filed:
Oct. 04, 2012
Applicant:
Flipchip International, Llc, Phoenix, AZ (US);
Inventors:
David Clark, Ipswich, GB;
Theodore G. Tessier, Chandler, AZ (US);
Assignee:
FlipChip International, LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
Abstract
A process for forming a heat sink on a semiconductor package at the wafer level stage of manufacture is disclosed. A semiconductor component wafer, prior to separation into separate component packages, is covered on one side with a resin metal foil layer. The resin foil layer is patterned by laser ablation to define the heat sink locations, and then a thermal paste is applied over the patterned layer. The thermal conductive paste is hardened to form the heat sinks. The wafer can then be separated into packages.