The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2013
Filed:
Apr. 26, 2012
Reynante Alvarado, Chandler, AZ (US);
Yuan LU, Phoenix, AZ (US);
Richard Redburn, Phoenix, AZ (US);
Flipchip International, LLC, Phoenix, AZ (US);
Abstract
A semiconductor package includes a device pad on a substrate. A first polymer layer overlies the substrate, and the first polymer layer has an opening to expose the device pad. In one embodiment, a redistribution layer (RDL) comprises a landing pad, and the RDL is positioned on the first polymer layer and conductively coupled to the device pad. A second polymer layer is on the RDL, and an under bump metal pad (UBM) is on the landing pad and extends onto a top surface of the second polymer layer. In one embodiment, a shortest distance from a center of the landing pad to an outer edge of the landing pad, and a shortest distance from a center of the UBM to an outer edge of the UBM are in a ratio that ranges from 0.5:1 up to 0.95:1.