Company Filing History:
Years Active: 2011-2013
Title: The Innovations of Richard Redburn
Introduction
Richard Redburn is a notable inventor based in Phoenix, AZ. He has made significant contributions to the field of semiconductor packaging, holding three patents that showcase his innovative approach to technology. His work is characterized by a focus on enhancing the efficiency and reliability of electronic devices.
Latest Patents
Richard's latest patents include advancements in solder bump interconnect technology. One of his patents describes a semiconductor package that features a device pad on a substrate, with a first polymer layer that has an opening to expose the device pad. This design incorporates a redistribution layer (RDL) that comprises a landing pad, which is positioned on the first polymer layer and is conductively coupled to the device pad. Additionally, a second polymer layer is placed on the RDL, with an under bump metal pad (UBM) on the landing pad, extending onto the top surface of the second polymer layer. The patent specifies that the ratio of distances from the center of the landing pad to its outer edge, and from the center of the UBM to its outer edge, ranges from 0.5:1 up to 0.95:1. Another patent further explores similar concepts, utilizing a polybenzoxazole (PBO) layer and detailing the electrical connections between the UBM and the landing pad.
Career Highlights
Richard Redburn is currently employed at Flipchip International LLC, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing innovative solutions that address the challenges faced in the electronics industry.
Collaborations
Richard collaborates with talented individuals such as Reynante Alvarado and Yuan Lu, who contribute to the dynamic environment at Flipchip International LLC. Their combined expertise fosters a culture of innovation and creativity.
Conclusion
Richard Redburn's contributions to semiconductor packaging through his patents reflect his commitment to advancing technology. His work not only enhances the performance of electronic devices but also sets a foundation for future innovations in the field.