Peter Elenius

Title: Innovations of Peter Elenius

Introduction

Peter Elenius is a notable inventor based in Scottsdale, AZ, who has made significant contributions to the field of electronic device packaging and circuit board design. With a total of 10 patents to his name, Elenius has demonstrated a commitment to advancing technology through innovative solutions.

Latest Patents

One of Elenius's latest patents is for an electronic device package and method for fabricating the same. This invention includes a substrate assembly and an electronic device that faces the substrate assembly. The package features a sealing ring or rings that consist of a sealing layer and a bonding layer, which is formed through a reaction with a low-melting-point material. This design enhances the reliability and performance of electronic devices. Another significant patent is for a method of forming a circuit board with improved via design. This invention involves a multi-layer circuit board that includes an electrically conductive sheet coated with insulating layers. The design allows for landless through-holes or vias that connect electrical conductors on opposing surfaces, improving the efficiency of circuit board assemblies.

Career Highlights

Throughout his career, Peter Elenius has worked with several companies, including Flip Chip Technologies and Flipchip International LLC. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects in the electronics industry.

Collaborations

Elenius has collaborated with notable professionals in his field, including Harry Hollack and Michael E Johnson. These collaborations have further enriched his work and led to advancements in technology.

Conclusion

Peter Elenius is a distinguished inventor whose work in electronic device packaging and circuit board design has made a lasting impact on the industry. His innovative patents and collaborations reflect his dedication to advancing technology.